3D NAND flash memory project was officially
9-layer 3D NAND test chip passed electrical
The design of 32L 3D NAND test chip was completed.
Yangtze Memory Technologies Co., Ltd. was established.
National IC Base Project was kicked off.
The design of 32L 3D NAND flash was completed.
The roof of fab 1 was sealed ahead.
The first silicon of 32L 3D NAND came out.
The first silicon of 64L 3D NAND came out.
YMTC introduced Xtacking® architecture and awarded
"Best of Show" at 2018 Flash Memory Summit.
32L 3D NAND flash memory was put into mass
64L 3D NAND flash memory was put into mass production.